Mechanical-chemical synthesis Ba0.77Sr0.23TiO3
نویسندگان
چکیده
منابع مشابه
Synergy between chemical dissolution and mechanical abrasion during chemical mechanical polishing of copper
Copper has been chosen as an interconnecting material in integrated circuits (IC) because of its low resistivity and high electromigration resistance compared to aluminum and aluminum alloy interconnects. It has been shown recently that the patterning difficulty of copper is resolved by the dual damascene technique, combined with a chemical/mechanical planarization (CMP) process. CMP is becomin...
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The Chemical-mechanical polishing (CMP) process is now widely employed in the ultra-large-scale integrated semiconductor fabrication. Due to the continuous decrease in the sub-micron feature size, characterization of erosion has become an important issue in Cu CMP. In this paper, the erosion in Cu CMP is considered at two levels: wafer and die levels. Erosion models are developed based on the m...
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A synthetic two-stage procedure was developed for the synthesis of moderately crosslinked polymers based on poly(aryl-ethereethereketone) (PEEK). Rigid crosslinks based on aromatic imines were synthetically introduced into PEEK polymer matrix resulting in PEEK materials with various degrees of crosslinking. Two specific crosslinked PEEK polymers (5% and 10% of ketone groups crosslinked) were ch...
متن کاملDesignable synthesis of nanocomposite hydrogels with excellent mechanical properties based on chemical cross-linked interactions.
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ژورنال
عنوان ژورنال: Science of Sintering
سال: 2012
ISSN: 0350-820X,1820-7413
DOI: 10.2298/sos1201047k